Michael Baker

Title: Michael Baker - Innovator in Microelectronic Packaging

Introduction

Michael Baker is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of microelectronic packaging, holding 2 patents that showcase his innovative approach to design and functionality.

Latest Patents

One of his latest patents is titled "Package structures with collapse control features." This invention involves microelectronic die package structures that include a substrate with conductive interconnect structures. The design features support elements on the substrate's peripheral regions, ensuring stability and functionality. A die is coupled to these interconnect structures, enhancing the overall performance of the package.

Another significant patent by Michael Baker is "Package structures with non-uniform interconnect features." This invention describes a substrate with solder structures arranged in both peripheral and central regions. The height variations between these solder structures allow for improved connectivity and performance of the microelectronic die, which is equipped with conductive die pads.

Career Highlights

Michael Baker is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic packaging technology. His work has been instrumental in developing innovative solutions that meet the demands of modern electronics.

Collaborations

Michael collaborates with talented coworkers, including Wenhao Li and Feras Eid. Their combined expertise contributes to the advancement of technology at Intel Corporation.

Conclusion

Michael Baker is a distinguished inventor whose work in microelectronic packaging has led to valuable patents and innovations. His contributions continue to shape the future of technology in the electronics industry.