Parola, Finland

Merja H Savola

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Bemis Company, Inc.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Merja H Savola. Retrieved from https://idiyas.com/inventor/merja-h-savola

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Merja H Savola: Innovator in Packaging Technology

Introduction

Merja H Savola is a notable inventor based in Parola, Finland. She has made significant contributions to the field of packaging technology, particularly with her innovative designs that enhance product usability and sustainability.

Latest Patents

Merja holds a patent for a peel-open package. This invention features a first film with an exterior sealant layer made from a polyolefin polymer resin combined with a fatty acid or its derivative. The second film consists of an exterior layer made from paper or a nonwoven material. The design allows for a peelable interface that effectively encloses a product while ensuring that the seal can be easily peeled without releasing free fibers from the paper or nonwoven material.

Career Highlights

Throughout her career, Merja has worked with prominent companies in the packaging industry, including Bemis Company, Inc. and Amcor Flexibles North America, Inc. Her experience in these organizations has contributed to her expertise in developing innovative packaging solutions.

Collaborations

Merja has collaborated with talented individuals such as Hanna-Mari Lahti and Christopher Rene Jansen. These partnerships have fostered creativity and innovation in her projects.

Conclusion

Merja H Savola's contributions to packaging technology exemplify her commitment to innovation and sustainability. Her work continues to influence the industry and inspire future advancements in packaging design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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