Meng-Tsung Kuo

Title: Meng-Tsung Kuo and Semiconductor Packaging Innovation.

Introduction

Meng-Tsung Kuo is an inventor associated with Tainan, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work includes a semiconductor package design that uses a protective lid and adhesive elements with different thermal conductivities.

Latest Patents

Kuo is named on 1 patent: “Package Structure with Protective Lid.” The invention describes a chip-containing structure positioned over a substrate, with a protective lid attached above it by adhesive elements. A first adhesive element sits directly above the chip-containing structure and has a lower thermal conductivity than multiple spaced-apart second adhesive elements. The lid extends across opposite sidewalls of the chip-containing structure. This arrangement combines lid attachment with differentiated thermal properties in the package structure.

Career Highlights

Kuo’s listed patent reflects work in semiconductor packaging, particularly the design of protective structures and thermal-management features. His association with Taiwan Semiconductor Manufacturing Company Limited places this work within the semiconductor manufacturing sector.

Collaborations

Kuo’s listed coworker is Chih-Kung Huang. Their shared association with the patent connects their work to the development of the protective-lid package structure.

Conclusion

Meng-Tsung Kuo’s patent documents an approach to semiconductor packaging that pairs a protective lid with adhesive elements designed to provide different thermal conductivities.