Company Filing History:
Years Active: 2003-2005
Title: Innovations by Inventor Meng-Tsang Lee
Introduction
Meng-Tsang Lee is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, focusing on innovations that enhance the yield rate of semiconductor products. With a total of 3 patents to his name, Lee's work is recognized for its practical applications in the industry.
Latest Patents
One of his latest patents is titled "Packaging mold with electrostatic discharge protection." This invention relates to a packaging mold that includes a pot block and at least one receiver. The pot block consists of multiple pots and runners, which are designed to inject molding compound into the runners through the pots. The receiver supports several substrate plates and connects the runners to receive the molding compound, ensuring that the dice packaged are protected from static electric charges. This innovation aims to increase the yield rate of semiconductor package products.
Another significant patent by Lee is "Packaging substrate with electrostatic discharge protection." This invention involves a packaging substrate that is deposited in a packaging mold equipped with injection pins. The substrate features a first and second copper-mesh layer that are electrically connected through position pins. The design includes recesses on the bottom side of the substrate that correspond to the injection pins, allowing static electric charges to be conducted away from the packaging substrate. This innovation also aims to prevent damage to the dies being packaged, thereby improving the yield rate of semiconductor products.
Career Highlights
Meng-Tsang Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has been instrumental in advancing the technology used in the industry, particularly in enhancing the reliability and efficiency of semiconductor products.
Collaborations
Lee collaborates with various professionals in his field, including his coworker Kuang-Lin Lo. Their combined expertise contributes to the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Meng-Tsang Lee's contributions to the field of semiconductor packaging through his innovative patents demonstrate his commitment to improving product reliability and efficiency. His work continues to influence the industry positively, making him a significant figure in the realm of semiconductor technology.