The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2004
Filed:
Nov. 07, 2002
Meng-Tsang Lee, Kaoshiung, TW;
Kuang-Lin Lo, Kaoshiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
The present invention relates to a packaging substrate with electrostatic discharge protection. The packaging substrate is deposited in a packaging mold, and the packaging mold comprises a plurality of injection pins for pushing the packaging substrate out of the packaging mold. A first copper-mesh layer and a second copper-mesh layer of the packaging substrate are electrically connected to each other via position pins. A bottom side of the packaging substrate comprises a plurality of recesses in positions corresponding to positions of the injection pins. The recesses pass the second copper-mesh layer to electrically connect the injection pins to the second copper-mesh layer, and static electric charges are conducted to the injection pins via the second copper-mesh layer and away from the packaging substrate. It prevents dies to be packaged from damage due to electrostatic discharge so as to raise the yield rate of semiconductor package products.