This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: The Innovations of Meng-Jou He
Introduction: Meng-Jou He is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging. His innovative work has led to the development of a unique electronic package and substrate structure.
Latest Patents: Meng-Jou He holds 1 patent for his invention titled "Electronic package and substrate structure thereof." This patent describes an electronic package and a substrate structure that includes a circuit layer and a filling layer formed on a substrate body. The circuit layer features multiple conductive traces that are separated from each other, allowing the filling layer to be positioned between these traces. Additionally, a portion of the circuit layer's surface and the filling layer's surface are covered with an insulating protective layer. This design enables the insulating protective layer to be thin, effectively preventing copper migration in subsequent processes.
Career Highlights: Meng-Jou He is associated with Siliconware Precision Industries Co., Ltd., where he has been instrumental in advancing electronic packaging technologies. His work has garnered attention for its innovative approach to substrate structures.
Collaborations: He has collaborated with notable colleagues, including Yuan-Chang Ni and Yu-Cheng Pai, contributing to various projects within the company.
Conclusion: Meng-Jou He's contributions to electronic packaging through his innovative patent demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.