This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Meng-Jie Lee: Inventor in Electronic Packaging
Introduction
Meng-Jie Lee is an inventor based in Taichung, Taiwan. His patent work includes an electronic packaging design intended to support miniaturization. Lee is associated with Siliconware Precision Industries, Ltd. His record includes 1 patent.
Latest Patents
Lee’s listed patent is “Electronic Package and Manufacturing Method Thereof.” It describes an electronic module containing first and second electronic elements, positioned on a carrier structure that embeds a third electronic element. The third element is a photonic chip electrically connected to the electronic module. This configuration can reduce the carrier structure’s layout area and help meet miniaturization requirements.
Career Highlights
Lee’s patent focuses on integrating electronic and photonic components within a compact package. The disclosed arrangement combines a carrier structure, an electronic module, and an embedded photonic chip.
Collaborations
Lee’s listed coworkers include Chih-Nan Lin and Ci-Hong Yan. The patent information provided identifies Siliconware Precision Industries, Ltd. as his company.
Conclusion
Meng-Jie Lee’s listed invention addresses electronic-package miniaturization through the integration of electronic elements and a photonic chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile