Pingtung, Taiwan

Meng Jen Wang

This inventor holds 4 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng Jen Wang. Retrieved from https://idiyas.com/inventor/meng-jen-wang-5y1lhyuu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.5

ph-index = 3

Forward Citations = 57(Granted Patents)


Location History:

  • Pintung, TW (2010)
  • Pingtung, TW (2004 - 2011)

Company Filing History:


Years Active: 2004-2011

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4 patents (USPTO):Explore Patents

Title: Innovations of Meng Jen Wang in Microelectromechanical Systems

Introduction

Meng Jen Wang is a notable inventor based in Pingtung, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS) with a total of four patents to his name. His work focuses on enhancing the efficiency and functionality of MEMS packages, which are crucial in various electronic applications.

Latest Patents

One of Meng Jen Wang's latest patents is a microelectromechanical system package. This innovative package includes a chip carrier, a first MEMS chip, a silicon cover, a layer of metal, a plurality of first bonding wires, and a sealant. The first MEMS chip is positioned on the chip carrier and features an active surface with an active area. The layer of metal is formed on the upper surface of the cover, while the first bonding wires electrically connect the active surface of the chip to the chip carrier. The sealant encapsulates the chip and the bonding wires, ensuring durability and performance.

Another significant patent involves a method for manufacturing a microelectromechanical system package. This method begins with forming a plurality of cavities on a silicon wafer's surface. The silicon wafer is then bonded to the MEMS wafer, aligning the active areas of the chips with the cavities. The assembly is subsequently singulated to create individual MEMS chips, which have their active areas covered by the cavities. This innovative approach reduces the profile of the MEMS package, enhancing its compactness and efficiency.

Career Highlights

Meng Jen Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in MEMS has positioned him as a key player in advancing the capabilities of electronic devices.

Collaborations

Meng Jen Wang has collaborated with notable colleagues, including Hsueh An Yang and Wei Chung Wang. Their combined efforts contribute to the innovative projects at Advanced Semiconductor Engineering, Inc.

Conclusion

Meng Jen Wang's contributions to microelectromechanical systems through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his significant role in the advancement of semiconductor technology. His innovative approaches continue to shape the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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