Megumi Maruyama

Title: Megumi Maruyama: Innovator in Copper Plating Technology

Introduction

Megumi Maruyama is a notable inventor based in Fujisawa, Japan. She has made significant contributions to the field of copper plating technology, particularly in the development of methods that enhance the reliability of copper plating on various substrates.

Latest Patents

Maruyama holds a patent for a "Copper plating bath and plating method for substrate using the copper plating bath." This innovative copper plating bath comprises a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate. The patent describes a method that provides highly reliable copper plating on substrates such as silicone wafer semiconductor substrates or printed boards with minute circuit patterns and small holes, including blind via-holes and through-holes.

Career Highlights

Throughout her career, Megumi Maruyama has demonstrated a strong commitment to advancing plating technologies. Her work has been instrumental in improving the quality and reliability of copper plating processes, which are critical in the electronics industry.

Collaborations

Maruyama has collaborated with notable colleagues, including Hideki Hagiwara and Ryoichi Kimizuka. These partnerships have contributed to her innovative work and the successful development of her patented technologies.

Conclusion

Megumi Maruyama is a pioneering inventor whose work in copper plating technology has made a significant impact in her field. Her contributions continue to influence advancements in semiconductor and printed board manufacturing.