The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2004
Filed:
May. 09, 2002
Hideki Hagiwara, Fujisawa, JP;
Ryoichi Kimizuka, Fujisawa, JP;
Yoshitaka Terashima, Fujisawa, JP;
Megumi Maruyama, Fujisawa, JP;
Takashi Miyake, Fujisawa, JP;
Hiroshi Nagasawa, Tokyo, JP;
Tsuyoshi Sahoda, Tokyo, JP;
Seiji Iimura, Tokyo, JP;
Other;
Abstract
A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.