Ryoichi Kimizuka

Title: Ryoichi Kimizuka: Innovator in Copper Plating Technology

Introduction

Ryoichi Kimizuka is a notable inventor based in Fujisawa, Japan. He has made significant contributions to the field of copper plating technology, holding a total of 3 patents. His work focuses on enhancing the reliability and efficiency of copper plating processes, particularly for semiconductor substrates and printed circuit boards.

Latest Patents

One of Kimizuka's latest patents is for a copper plating bath and plating method for substrates using this bath. This innovative copper plating bath comprises a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate. The method aims to provide highly reliable copper plating on substrates such as silicone wafer semiconductor substrates or printed boards that feature minute circuit patterns and small holes, including blind via-holes and through-holes.

Career Highlights

Throughout his career, Ryoichi Kimizuka has worked with Ebara-udylite Co., Ltd., where he has contributed to advancements in plating technology. His expertise in this area has positioned him as a key figure in the development of innovative solutions for the electronics industry.

Collaborations

Kimizuka has collaborated with notable professionals in his field, including Hideki Hagiwara and Yoshitaka Terashima. These collaborations have further enriched his work and contributed to the success of his inventions.

Conclusion

Ryoichi Kimizuka's contributions to copper plating technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the electronics industry and provide effective solutions for reliable manufacturing processes.