Megha Rao

Title: Megha Rao: Innovator in Semiconductor Technology

Introduction

Megha Rao is a prominent inventor based in Clifton Park, NY (US). She has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase her innovative approach to device integration.

Latest Patents

Her latest patents include an "Apparatus and method for integration of through substrate vias" and a "Method for thin die-to-wafer bonding." The first patent provides an apparatus that integrates through substrate vias (TSVs) into devices before processing device contacts. This apparatus features a semiconducting layer, CMOS devices, and a metal layer that enables precise placement of bond pads for bonding to a second device wafer. The method outlined in this patent involves several processing steps on a wafer of semiconducting material, ensuring efficient integration of TSVs.

The second patent details a method for bonding a die to a base technology wafer. This process includes providing a device wafer with TSVs, bonding it to a carrier wafer, and subsequently removing substrate material to expose metallization features. The method culminates in dicing the device wafer into individual die and bonding them to a base technology wafer, enhancing the efficiency of semiconductor manufacturing.

Career Highlights

Megha Rao is affiliated with the State University of New York, where she continues to advance her research and development in semiconductor technologies. Her work has positioned her as a key figure in the innovation landscape of this field.

Collaborations

Some of her notable coworkers include Daniel Pascual and Jeremiah Hebding, who contribute to her research endeavors and collaborative projects.

Conclusion

Megha Rao's contributions to semiconductor technology through her patents reflect her dedication to innovation and advancement in the field. Her work not only enhances device integration but also paves the way for future developments in semiconductor manufacturing.