Mee Sing Tiong

Title: Innovations by Mee Sing Tiong in Semiconductor Packaging

Introduction

Mee Sing Tiong is an accomplished inventor based in Ipoh Perak, Malaysia. She has made significant contributions to the field of semiconductor packaging, showcasing her expertise through her innovative patent. Her work is vital in advancing electronic packaging technologies.

Latest Patents

Mee Sing Tiong holds a patent for a semiconductor package. This patent discloses a method of making an electronic package by forming a metal base on which to build the components of the package. The process involves applying a mask layer on the base to an area that is not to be occupied by interconnection pads or die attachment pads. Layers of metal are then plated on the unmasked areas of the base to form the necessary pads. After removing the mask layer, a semiconductor die is mounted to at least one die attachment pad, and it is electrically connected to one or more interconnection pads. The components are embedded in an encapsulation material to form a package, which is then cut into discrete package units.

Career Highlights

Mee Sing Tiong is currently employed at Unisem (M) Berhad, where she continues to innovate in the semiconductor field. Her work has been instrumental in enhancing the efficiency and reliability of electronic packages.

Collaborations

Mee Sing Tiong collaborates with Andrew Wye Choong Low, contributing to the development of advanced semiconductor technologies.

Conclusion

Mee Sing Tiong's contributions to semiconductor packaging through her innovative patent highlight her role as a leading inventor in the field. Her work continues to influence the electronics industry positively.