The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Jul. 22, 2004
Andrew Wye Choong Low, Menglembu Perak, MY;
Mee Sing Tiong, Ipoh Perak, MY;
Andrew Wye Choong Low, Menglembu Perak, MY;
Mee Sing Tiong, Ipoh Perak, MY;
Unisem (M) Berhad, Perak, MY;
Abstract
There is disclosed a method of making an electronic package () by: forming a metal base () on which to build the components of an electronic package; applying a mask layer () on the base to an area that is not to be occupied by interconnection pads () or die attachment pads () of the package; plating layers of metal on the un-masked areas of the base to form the interconnection and die attachment pads (); removing the mask layer; mounting a semiconductor die () to at least one die attachment pad (); electrically connecting the semiconductor die () to one or more interconnection pads (); embedding the components on the base in an encapsulation material () to form a package; removing the metal base () to leave a package panel; and cutting the panel into discrete package units.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile