Max T Stein

Title: Max T Stein: Innovator in 3D Imaging Technology

Introduction

Max T Stein is a notable inventor based in Santa Clara, CA. He has made significant contributions to the field of 3D imaging technology. His innovative work focuses on enhancing point-to-point distance measurements in 3D camera images.

Latest Patents

Max T Stein holds a patent for "Point-to-point distance measurements in 3D camera images." This patent describes systems and methods for determining point-to-point distances from 3D image data. In some embodiments, two measure points specified by a user represent endpoints on an object of interest within an image frame. The technology assumes that all points lying between these endpoints also belong to the object of interest. Additional 3D data associated with points along a measurement line defined by the measure points can be leveraged to provide a robust distance measurement. Total least squares fitting is performed, for example, through Robust Principal Component Analysis (RPCA) to identify linear structures within the set of 3D coordinates on the measurement line. The minimum covariance determinant (MCD) estimator of the covariance matrix of the data is computed for a highly robust estimate of multivariate location and multivariate scatter.

Career Highlights

Max T Stein is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work at Intel has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his notable coworkers include Kalpana Seshadrinathan and Oscar Nestares. Their collaborative efforts contribute to the advancement of innovative technologies in 3D imaging.

Conclusion

Max T Stein's contributions to 3D imaging technology exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to advancing the field.