Mavis J Chaboya

Title: Mavis J Chaboya: Innovator in Semiconductor Technology

Introduction

Mavis J Chaboya is a notable inventor based in San Jose, California. She has made significant contributions to the field of semiconductor technology, particularly in the area of polysilicon layer removal processes. Her innovative approach has garnered attention in the industry.

Latest Patents

Mavis holds a patent for an "Etch back process approach in dual source plasma reactors." This method involves removing a polysilicon layer from a semiconductor wafer using a downstream plasma source to first planarize the wafer. The process effectively removes contours in the polysilicon layer that are caused by deposition over lithographic features, such as via holes. Following the planarizing process, the wafer is exposed to a plasma generated by a direct, radio frequency plasma source, which may work in conjunction with the downstream plasma source to perform bulk etching of the polysilicon. This invention is capable of producing a planar surface topography after the top layer of the film is removed, ensuring that the residual recess height of the polysilicon plug filling a via hole is less than about 10 nm.

Career Highlights

Mavis is currently employed at Novellus Systems Incorporated, where she continues to advance her research and development efforts in semiconductor technologies. Her work has been instrumental in improving manufacturing processes within the industry.

Collaborations

Mavis has collaborated with several talented individuals, including Cindy Wailam Chen and Eddie Chiu. These collaborations have contributed to the success of her projects and innovations.

Conclusion

Mavis J Chaboya is a pioneering inventor whose work in semiconductor technology has led to significant advancements in the field. Her innovative patent demonstrates her commitment to improving manufacturing processes and enhancing the efficiency of semiconductor devices.