Berlin, Germany

Matthias Klein

This inventor holds 5 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Microchip Technology Inc., University of Utah Research Foundation. Active years: 2008-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matthias Klein. Retrieved from https://idiyas.com/inventor/matthias-klein-b5rbdr0u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 80.0

 

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2008-2022

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5 patents (USPTO):Explore Patents

Dear valued reader, below is an article about the accomplished inventor Matthias Klein:

Title: Innovator Spotlight: Matthias Klein's Pioneering Patents

Introduction:

Matthias Klein, an esteemed inventor based in Berlin, Germany, has made significant contributions to the field of semiconductor packaging. With a keen eye for innovation and a dedication to pushing boundaries, Klein has garnered recognition for his groundbreaking work in the industry.

Latest Patents:

Klein's latest patents showcase his ingenuity in the realm of semiconductor packaging. One notable invention is the "Method for forming packaged semiconductor die with micro-cavity," which revolutionizes the process of forming electronic dies. By utilizing a photoresist frame and encapsulant material, this method enhances the efficiency and quality of packaged electronic dies.

Another remarkable patent is the "Packaged semiconductor die with micro-cavity," which introduces a novel approach to packaging electronic dies. Featuring a micro-cavity and an innovative sealing mechanism, this packaged electronic die exemplifies Klein's commitment to advancing semiconductor technology.

Career Highlights:

Throughout his career, Matthias Klein has worked with esteemed institutions such as the University of Utah Research Foundation and Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. His tenure at these renowned organizations has provided him with invaluable experience and resources to fuel his inventive spirit.

Collaborations:

Klein's collaborations with talented individuals like Hans-Hermann Oppermann and Florian Solzbacher have been instrumental in shaping his innovative projects. By fostering a culture of teamwork and knowledge-sharing, Klein has leveraged the expertise of his colleagues to bring his inventive ideas to life.

Conclusion:

In conclusion, Matthias Klein stands as a trailblazer in the field of semiconductor packaging, with a track record of pioneering patents and collaborations that have propelled the industry forward. His relentless pursuit of innovation and commitment to excellence continue to inspire the next generation of inventors and researchers in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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