The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Dec. 01, 2006
Florian Solzbacher, Salt Lake City, UT (US);
Reid Harrison, Salt Lake City, UT (US);
Richard A. Normann, Park City, UT (US);
Hans-hermann Oppermann, Berlin, DE;
Lothar Dietrich, Werder (Havel), DE;
Matthias Klein, Berlin, DE;
Michael Töpper, Berlin, DE;
Florian Solzbacher, Salt Lake City, UT (US);
Reid Harrison, Salt Lake City, UT (US);
Richard A. Normann, Park City, UT (US);
Hans-Hermann Oppermann, Berlin, DE;
Lothar Dietrich, Werder (Havel), DE;
Matthias Klein, Berlin, DE;
Michael Töpper, Berlin, DE;
University of Utah Research Foundation, Salt Lake City, UT (US);
Fraunhofer-Gesellschaft zur Foerderung der angewan, Munich, DE;
Abstract
Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.