Matthew Smalley

Title: The Innovative Contributions of Matthew Smalley

Introduction

Matthew Smalley is an accomplished inventor based in Ballston Lake, NY (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to through substrate vias (TSVs). His work has implications for the integration of advanced devices in the semiconductor industry.

Latest Patents

Matthew Smalley holds a patent for an "Apparatus and method for integration of through substrate vias." This invention provides a comprehensive approach to integrating TSVs into devices before the processing of device contacts. The apparatus includes a semiconducting layer, one or more CMOS devices mounted on the top surface of the semiconducting layer, and one or more TSVs integrated into the semiconducting layer of the device wafer. Additionally, it features at least one metal layer applied over the TSVs and one or more bond pads mounted onto the top layer of the metal layer. This arrangement allows for the precise placement of bond pads for bonding to a second device wafer. The method involves obtaining a wafer of semiconducting material, performing front end of line processing, providing TSVs in the wafer, and conducting middle and back end of line processing.

Career Highlights

Matthew Smalley is affiliated with the State University of New York, where he continues to advance his research and development efforts. His work has garnered attention for its innovative approach to semiconductor integration, showcasing his expertise in the field.

Collaborations

Some of Matthew's notable coworkers include Jeremiah Hebding and Megha Rao, who contribute to the collaborative environment that fosters innovation and research at the State University of New York.

Conclusion

Matthew Smalley's contributions to the field of semiconductor technology through his patent on TSV integration highlight his role as an influential inventor. His work not only advances the technology but also sets a foundation for future innovations in the industry.