Matthew J Gehman

Title: Innovations by Inventor Matthew J. Gehman

Introduction

Matthew J. Gehman, an innovative inventor based in Bally, Pennsylvania, has made significant contributions in the field of integrated circuits. With a focus on enhancing routing resources and bypass capacitance, he holds one patent that showcases his expertise and ingenuity.

Latest Patents

Matthew's notable patent is for an integrated circuit power grid that features improved routing resources and bypass capacitance. This invention comprises a plurality of thick metal layers with various metal traces, designed to accommodate a lower pitch than what is typically allowed under industry design rules for integrated circuit fabrication technology. Additionally, the power grid incorporates thin metal layers with interconnected metal traces, which are strategically linked by vias. These vias are carefully positioned at intersections to optimize performance and efficiency in circuit design.

Career Highlights

Matthew is currently employed at Avago Technologies General IP (Singapore) Pte. Ltd., a leading company in technology development. His work in developing cutting-edge integrated circuit solutions has positioned him as a key contributor in the innovation landscape.

Collaborations

Throughout his career, Matthew has collaborated with notable colleagues, including Scott A. Segan and Scott T. Van Horn. Their combined expertise has furthered advancements in integrated circuit technologies and showcases the collaborative spirit that drives innovation in the field.

Conclusion

Matthew J. Gehman's contributions to integrated circuit technology are a testament to his inventive spirit and dedication to advancing the field. His patent demonstrates a commitment to enhancing the efficiency and effectiveness of power grid design in integrated circuits, impacting technology for years to come.