This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Innovations by Matthew G Bausch
Introduction
Matthew G Bausch is an accomplished inventor based in South Burlington, Vermont. He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique patent that enhances the manufacturing process of integrated circuits.
Latest Patents
Matthew holds a patent titled "Methods of localized hardening of dicing channel by applying localized heat in wafer kerf." This patent involves various embodiments that include the localized hardening of dicing channels in an integrated circuit (IC) wafer. The method consists of applying localized heat to a metal interconnect in a wafer kerf on an IC wafer using a heat source. After applying the localized heat, the heat source is removed to cool the metal interconnect, which increases the hardness of the metal interconnect.
Career Highlights
Matthew is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and implement innovative solutions in the technology sector. He has a proven track record of developing methods that improve the efficiency and effectiveness of integrated circuit manufacturing.
Collaborations
Matthew has collaborated with notable coworkers, including Eric D Marz and Benjamin J Pierce. Their combined expertise has contributed to the advancement of technology within their field.
Conclusion
Matthew G Bausch is a notable inventor whose work has significantly impacted the integrated circuit industry. His innovative patent demonstrates his commitment to enhancing manufacturing processes. His contributions continue to influence the future of technology.