International Business Machines Corporation

Matthew G Bausch

Jared P Yanofsky

Eric D Marz

Benjamin J Pierce

Various embodiments include localized hardening of dicing channels in an integrated circuit (IC) wafer. In some embodiments, a method includes: applying localized heat to a metal interconnect in a wafer kerf on an IC wafer using a heat source; and removing the heat source to cool the metal interconnect after the applying of the localized heat to the metal interconnect, wherein the applying of the heat and the removing of the heat source increases a hardness of the metal interconnect.

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South Burlington, VT, United States of America

Matthew G Bausch