Windsor, NY, United States of America

Matthew Francis Seward


Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 121(Granted Patents)


Company Filing History:


Years Active: 1996-2006

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8 patents (USPTO):Explore Patents

Title: Matthew Francis Seward: Innovator in Circuit Layer Interconnections

Introduction

Matthew Francis Seward is a notable inventor based in Windsor, NY (US). He holds a total of 8 patents that showcase his contributions to the field of electronic structures and circuit interconnections. His innovative work has significantly impacted the way electronic devices are designed and connected.

Latest Patents

One of Seward's latest patents is titled "Method and apparatus to establish circuit layers interconnections." This patent describes a method and associated structure for forming a conductive path within a laminate. A conductive element is pressed into an opening in the laminate, ensuring that a portion of at least one end of the conductive element extends beyond the surface of the laminate. A compressive pressure is then applied to this portion, forming a contact pad that extends beyond the laminate's surface. The conductive element may consist of an inner element covered by an outer element.

Another significant patent is "Multi-layered high density connections." This invention includes a multi-layer electronic structure that enhances the capacity for attaching active or passive devices. It achieves this by creating a three-dimensional grid of connection points, allowing for efficient electrical coupling of surface-mounted devices to edge-mounted devices. This grid pattern is versatile and can be utilized with various laminates, including circuit cards and flexible circuits. The structure is designed to facilitate rapid data transmission, such as optical data from a spectroscope through a VCSEL laser to a computer for diagnostics and analysis.

Career Highlights

Matthew Seward is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to explore various aspects of electronic design and circuit interconnections, contributing to the company's reputation as a leader in technology.

Collaborations

Seward has collaborated with several talented individuals in his field, including Christopher John Majka and How Tzu Lin. These collaborations have fostered an environment of innovation and creativity, leading to advancements in electronic structures.

Conclusion

Matthew Francis Seward is a distinguished inventor whose work in circuit layer interconnections has made a significant impact on the electronics industry. His patents reflect a commitment to innovation and excellence in technology.

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