Waconia, MN, United States of America

Matthew Bren

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matthew Bren. Retrieved from https://idiyas.com/inventor/matthew-bren

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Matthew Bren: Innovator in Thermal Interface Technology

Introduction

Matthew Bren is a notable inventor based in Waconia, MN (US). He has made significant contributions to the field of thermal interface technology, particularly through his innovative patent. His work focuses on enhancing the efficiency of thermal dissipation in electronic packages.

Latest Patents

Matthew Bren holds a patent for a "Three-dimensionally patternable thermal interface." This invention allows for a customized three-dimensional geometry of a thermal interface body that can effectively fill irregular gaps along a thermal dissipation pathway in electronic packages. The thermal interface body is created using an additive deposition process, where sequential patterns of thermal interface material are coherently connected to other deposited patterns.

Career Highlights

Matthew is currently employed at Henkel AG & Co. KGaA, where he continues to develop innovative solutions in thermal management. His expertise in this area has positioned him as a valuable asset to his team and the company.

Collaborations

Matthew collaborates with talented coworkers, including Pradyumna Goli and Reid J Chesterfield. Their combined efforts contribute to advancing the technology and applications of thermal interfaces.

Conclusion

Matthew Bren's work in thermal interface technology exemplifies innovation in addressing the challenges of thermal management in electronics. His contributions are paving the way for more efficient electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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