The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Apr. 25, 2022
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Pradyumna Goli, Prior Lake, MN (US);
Reid J. Chesterfield, Eden Prairie, MN (US);
Matthew Bren, Waconia, MN (US);
Kevin Olson, St. Paul, MN (US);
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B29C 64/112 (2017.01); B29C 64/209 (2017.01); B29C 64/336 (2017.01); B29K 83/00 (2006.01); B29K 105/00 (2006.01); B29K 105/24 (2006.01); B29L 31/34 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
H05K 7/20481 (2013.01); B29C 64/112 (2017.08); B29C 64/209 (2017.08); B29C 64/336 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B29K 2083/00 (2013.01); B29K 2105/0094 (2013.01); B29K 2105/24 (2013.01); B29K 2995/0013 (2013.01); B29K 2995/0094 (2013.01); B29L 2031/34 (2013.01);
Abstract
A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.