Saint Paul, MN, United States of America

Kevin Olson

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kevin Olson. Retrieved from https://idiyas.com/inventor/kevin-olson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Kevin Olson: Innovator in Thermal Interface Technology

Introduction

Kevin Olson is a notable inventor based in Saint Paul, MN (US). He has made significant contributions to the field of thermal interface materials, particularly through his innovative patent. His work focuses on enhancing the efficiency of thermal dissipation pathways in electronic packages.

Latest Patents

Kevin Olson holds a patent for a "Three-dimensionally patternable thermal interface." This invention allows for a three-dimensional geometry of a thermal interface body to be customized, enabling it to substantially fill irregular gaps along thermal dissipation pathways. The thermal interface body is fabricated through an additive deposition process, where sequential patterns of thermal interface material are coherently connected to other deposited patterns.

Career Highlights

Kevin Olson is currently employed at Henkel AG & Co. KGaA, where he continues to develop innovative solutions in thermal management. His expertise in additive manufacturing and thermal interface materials has positioned him as a key player in the industry.

Collaborations

Kevin has collaborated with talented coworkers such as Pradyumna Goli and Reid J Chesterfield, contributing to advancements in their field.

Conclusion

Kevin Olson's work in thermal interface technology exemplifies innovation and dedication to improving electronic package performance. His contributions are paving the way for more efficient thermal management solutions in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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