This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Pradyumna Goli: Innovator in Thermal Interface Technology
Introduction
Pradyumna Goli is an accomplished inventor based in Prior Lake, MN (US). He has made significant contributions to the field of thermal interface materials, showcasing his innovative spirit through his patented technology.
Latest Patents
Goli holds a patent for a "Three-dimensionally patternable thermal interface." This invention allows for a customized three-dimensional geometry of a thermal interface body that can effectively fill irregular gaps along a thermal dissipation pathway in electronic packages. The thermal interface body is produced through an additive deposition process, where sequential patterns of thermal interface material are coherently connected to other deposited patterns.
Career Highlights
Pradyumna Goli is currently employed at Henkel AG & Co. KGaA, where he continues to develop cutting-edge solutions in thermal management. His work is pivotal in enhancing the efficiency of electronic devices through improved thermal interface technologies.
Collaborations
Goli collaborates with talented professionals in his field, including Reid J Chesterfield and Matthew Bren. Their combined expertise fosters an environment of innovation and creativity.
Conclusion
Pradyumna Goli's contributions to thermal interface technology exemplify his dedication to innovation. His patented work not only addresses current challenges in electronic packaging but also paves the way for future advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile