Morgan Hill, CA, United States of America

Matthew Boyd

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.6

ph-index = 1


Company Filing History:


Years Active: 2023-2024

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Matthew Boyd

Introduction

Matthew Boyd is a notable inventor based in Morgan Hill, CA (US). He has made significant contributions to the field of electrostatic chuck technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electrostatic chucks used in various processing operations.

Latest Patents

One of Matthew Boyd's latest patents is titled "Forming mesas on an electrostatic chuck." This invention involves a body of an electrostatic chuck that comprises mesas disposed on a polished surface. Each mesa includes an adhesion layer, a transition layer, and a coating layer with a hardness of at least 14 GPa. The method for preparing this body includes polishing and cleaning the surface, followed by the deposition of the mesas.

Another significant patent is related to "Methods, systems, and apparatus for conducting chucking operations using an adjusted chucking voltage if a process shift occurs." This invention outlines a method for conducting processing operations on a substrate while applying a chucking voltage to an electrostatic chuck. It includes determining if a process shift has occurred and adjusting the chucking voltage accordingly.

Career Highlights

Matthew Boyd is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His work at Applied Materials has allowed him to contribute to advancements in technology that are crucial for modern manufacturing processes.

Collaborations

Matthew has collaborated with notable coworkers such as Wendell Glenn Boyd, Jr. and Stanley Wu. These collaborations have likely fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Matthew Boyd's contributions to the field of electrostatic chuck technology are noteworthy. His innovative patents and work at Applied Materials, Inc. demonstrate his commitment to advancing technology in the semiconductor industry. His efforts continue to impact the efficiency and effectiveness of processing operations.

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