This inventor holds 1 USPTO granted patent. Top assignee: Ttm Technologies Inc.. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Matt Gortner: Innovator in Near-Hermetic Packaging Technology
Introduction
Matt Gortner is an accomplished inventor based in Santa Ana, CA (US). He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance the functionality and efficiency of electronic components. With a focus on creating low-cost solutions, Gortner's work is paving the way for advancements in the industry.
Latest Patents
Gortner holds a patent for a "Near-hermetic package with flexible signal input and output." This patent describes a low-cost near-hermetic package that includes a substrate designed to support one or more internal components. The package features an enclosure with a cavity surrounding the internal components and a first sidewall that extends upward from the substrate. This first sidewall is coupled to the substrate, providing structural integrity. Additionally, the package incorporates a first flexible circuit with conductive traces that connect to the internal components. The flexible circuit consists of three sections: one outside the enclosure, one inside, and a third section that joins the enclosure and substrate.
Career Highlights
Gortner's career is marked by his dedication to innovation and problem-solving in the field of packaging technology. His work at TTM Technologies Inc. has allowed him to collaborate with other talented professionals and contribute to the development of cutting-edge solutions. His patent reflects his commitment to creating efficient and cost-effective packaging options for electronic devices.
Collaborations
Throughout his career, Gortner has worked alongside notable colleagues, including Michael Len and Nicholas S. Koop. These collaborations have fostered an environment of creativity and innovation, leading to advancements in their respective fields.
Conclusion
Matt Gortner is a prominent inventor whose work in near-hermetic packaging technology has made a significant impact on the industry. His innovative designs and collaborative efforts continue to drive advancements in electronic component packaging.