Sollentuna, Sweden

Mats Rehnström

This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignee: Telefonaktiebolaget Lm Ericsson (Publ). Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mats Rehnström. Retrieved from https://idiyas.com/inventor/mats-rehnström

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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4 patents (USPTO):Explore Patents

Title: Mats Rehnström: Innovator in Printed Circuit Board Technology

Introduction

Mats Rehnström is a notable inventor based in Sollentuna, Sweden. He has made significant contributions to the field of printed circuit board (PCB) technology, holding a total of 4 patents. His work focuses on integrating advanced communication capabilities into PCB designs.

Latest Patents

Mats Rehnström's latest patents include innovative designs for a printed circuit board with integrated antenna elements. This invention allows for the transmission and reception of radio frequency signals, enhancing wireless communication capabilities. Another notable patent involves a multilayer PCB designed for optical broadcast transmission. This technology utilizes a transparent layer to reflect and transmit optical signals, showcasing a novel approach to data transmission in circuit boards.

Career Highlights

Mats Rehnström is associated with Telefonaktiebolaget LM Ericsson (publ), a leading telecommunications company. His work at Ericsson has positioned him at the forefront of PCB innovation, contributing to advancements in communication technology.

Collaborations

Mats has collaborated with esteemed colleagues such as Marie Press and Lars Olof Gerhard Winberg. Their combined expertise has fostered a creative environment that drives innovation in PCB technology.

Conclusion

Mats Rehnström's contributions to printed circuit board technology exemplify the intersection of innovation and communication. His patents reflect a commitment to advancing the capabilities of electronic devices, making a lasting impact in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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