This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Kleb-Und Giessharztechnik Dr. Ludeck Gmbh, Siemens Aktiengesellschaft. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2018
Title: Mathias Nowottnick: Innovator in SMD Mounting Technology
Introduction
Mathias Nowottnick is a notable inventor based in Rostock, Germany. He has made significant contributions to the field of electronics, particularly in the area of surface-mount device (SMD) technology. His innovative approach has led to the development of a unique heating element designed for SMD mounting.
Latest Patents
Mathias Nowottnick holds a patent for a heating element specifically designed for SMD mounting. This invention relates to the integration of heating elements that can be mounted onto substrates, such as circuit carriers. The heating element features a mounting side for SMD applications, a housing that encloses a cavity, and a reactive substance within the cavity that reacts exothermically at a specific reaction temperature. This technology enhances the efficiency and effectiveness of electronic assemblies.
Career Highlights
Throughout his career, Mathias Nowottnick has worked with prominent companies, including Siemens Aktiengesellschaft and Kleb-und Giessharztechnik Dr. Ludeck GmbH. His experience in these organizations has contributed to his expertise in electronic components and assembly processes.
Collaborations
Mathias has collaborated with several professionals in his field, including Michael Hanisch and Heiko Huth. These partnerships have allowed him to further refine his inventions and contribute to advancements in SMD technology.
Conclusion
Mathias Nowottnick is a distinguished inventor whose work in SMD mounting technology has made a significant impact in the electronics industry. His innovative heating element patent exemplifies his commitment to enhancing electronic assembly processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile