The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Mar. 29, 2016
Applicants:

Siemens Aktiengesellschaft, München, DE;

Kleb- Und Gieβharztechnik Dr. Ludeck Gmbh, Vogelsdorf, DE;

Inventors:

Michael Hanisch, Hohen Neuendorf, DE;

Heiko Huth, Rostock, DE;

Wolfgang Ludeck, Berlin, DE;

Bernd Mueller, Falkenberg, DE;

Mathias Nowottnick, Rostock, DE;

Andrey Prihodovsky, Bayreuth, DE;

Dirk Seehase, Rostock, DE;

Ulrich Wittreich, Velten, DE;

Dirk Wormuth, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 1/18 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); B23K 1/0006 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); H05K 1/181 (2013.01); B23K 2201/42 (2013.01); H05K 2203/176 (2013.01);
Abstract

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T.


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