Company Filing History:
Years Active: 2024-2025
Title: Masayuki Iwasaki: Innovator in Adhesive Technology
Introduction
Masayuki Iwasaki is a prominent inventor based in Annaka, Japan. He has made significant contributions to the field of adhesive technology, particularly in the development of materials for flexible printed-wiring boards (FPC). With a total of 2 patents, Iwasaki's work has had a notable impact on the electronics industry.
Latest Patents
Iwasaki's latest patents include an adhesive composition for flexible printed-wiring boards and a heat-curable resin film, prepreg, and FPC substrate containing the same. The adhesive composition is designed to exhibit low dielectric properties while maintaining high adhesion strength to low-dielectric resin films and copper foil. It also demonstrates excellent moisture resistance and reflow resistance. The resin composition boasts low melt viscosity and is capable of being transformed into a cured product with high heat resistance, adhesion, and a high glass-transition temperature, all while maintaining low permittivity and dielectric tangent.
Career Highlights
Iwasaki is associated with Shin-Etsu Chemical Co., Ltd., where he has been instrumental in advancing adhesive technologies. His innovative approaches have led to the development of materials that meet the demanding requirements of modern electronics.
Collaborations
Iwasaki has collaborated with notable colleagues such as Hiroyuki Iguchi and Naoyuki Kushihara. Their combined expertise has contributed to the successful development of advanced adhesive solutions.
Conclusion
Masayuki Iwasaki's contributions to adhesive technology are significant and impactful. His patents reflect a commitment to innovation and excellence in the field, making him a key figure in the advancement of materials for flexible printed-wiring boards.