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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12421435 B1

PDFFull Text
Date of Patent:
Sep. 23, 2025

Filed:

Mar. 16, 2022

Adhesive composition for flexible printed-wiring board (fpc), and heat-curable resin film, prepreg and fpc substrate containing same

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Atsushi Tsuura, Annaka, JP;

Yoshihiro Tsutsumi, Annaka, JP;

Hiroyuki Iguchi, Annaka, JP;

Yuki Kudo, Annaka, JP;

Masayuki Iwasaki, Annaka, JP;

Rina Sasahara, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Tri V Nguyen

Int. Cl.
CPC ...
C09J 179/08 (2006.01); C08K 3/36 (2006.01); C08K 5/3445 (2006.01); C08K 5/3492 (2006.01); C08K 9/06 (2006.01); C09J 7/35 (2018.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09J 179/08 (2013.01); C08K 3/36 (2013.01); C08K 5/3445 (2013.01); C08K 5/3492 (2013.01); C08K 9/06 (2013.01); C09J 7/35 (2018.01); H05K 1/0373 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08);
Abstract

Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains:

Find Patent Forward Citations

Tsuura, Atsushi. (2025). Adhesive composition for flexible printed-wiring board (fpc), and heat-curable resin film, prepreg and fpc substrate containing same (U.S. Patent No. 12421435). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12421435

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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