The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Mar. 16, 2022
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Atsushi Tsuura, Annaka, JP;
Yoshihiro Tsutsumi, Annaka, JP;
Hiroyuki Iguchi, Annaka, JP;
Yuki Kudo, Annaka, JP;
Masayuki Iwasaki, Annaka, JP;
Rina Sasahara, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 179/08 (2006.01); C08K 3/36 (2006.01); C08K 5/3445 (2006.01); C08K 5/3492 (2006.01); C08K 9/06 (2006.01); C09J 7/35 (2018.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09J 179/08 (2013.01); C08K 3/36 (2013.01); C08K 5/3445 (2013.01); C08K 5/3492 (2013.01); C08K 9/06 (2013.01); C09J 7/35 (2018.01); H05K 1/0373 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08);
Abstract
Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains: