Atsushi Tsuura

Title: Innovations by Atsushi Tsuura

Introduction

Atsushi Tsuura is a notable inventor based in Annaka, Japan. He has made significant contributions to the field of adhesive compositions, particularly for flexible printed-wiring boards (FPC). With a total of 3 patents to his name, Tsuura's work is recognized for its innovative approach to enhancing the performance of electronic components.

Latest Patents

Tsuura's latest patents include an adhesive composition for flexible printed-wiring boards and a heat-curable resin film, prepreg, and FPC substrate containing the same. The adhesive composition is designed to exhibit low dielectric properties while maintaining high adhesion strength to low-dielectric resin films and copper foil. It also boasts excellent moisture resistance and reflow resistance. The composition includes a low-dielectric heat dissipation film that consists of a maleimide resin composition and boron nitride particles, resulting in a film with a relative dielectric constant of 3.5 or less at a frequency of 10 GHz.

Career Highlights

Tsuura is currently employed at Shin-Etsu Chemical Co., Ltd., where he continues to develop innovative materials for the electronics industry. His work has been instrumental in advancing the technology used in flexible printed-wiring boards, which are essential for modern electronic devices.

Collaborations

Throughout his career, Tsuura has collaborated with talented individuals such as Hiroyuki Iguchi and Yuki Kudo. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Atsushi Tsuura's contributions to adhesive compositions for flexible printed-wiring boards highlight his innovative spirit and dedication to advancing technology in the electronics sector. His work continues to influence the industry and pave the way for future innovations.