Shin-etsu Chemical Co., Ltd.

Atsushi Tsuura

Yoshihiro Tsutsumi

Hiroyuki Iguchi

Yuki Kudo

Yoshinori Takamatsu

Rina Sasahara

Masayuki Iwasaki

Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains:

Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film

Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises:

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Annaka, Japan

Atsushi Tsuura