The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Dec. 13, 2021
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 73/10 (2006.01); C08J 5/24 (2006.01); C08K 5/5317 (2006.01); C08L 63/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08G 73/1067 (2013.01); C08G 73/1075 (2013.01); C08J 5/24 (2013.01); C08K 5/5317 (2013.01); H05K 1/188 (2013.01); C08L 63/00 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); H05K 2201/0355 (2013.01);
Abstract
Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: and