This inventor holds 1 USPTO granted patent and 3 published patent applications and 4 EPO patents. Top assignee: Kyodo Printing Co., Ltd.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Innovations by Masayuki Hosoi in Blister Packaging Technology.
Introduction
Masayuki Hosoi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, particularly in the development of blister packages. His innovative approach has led to advancements that enhance the functionality and reliability of packaging solutions.
Latest Patents
Masayuki Hosoi holds a patent for an "Absorbing layer for blister package, laminate comprising same, and blister package using said laminate." The purpose of this invention is to provide an absorbent layer for blister packs that imparts sufficient formability and is free from forming failure, even when a pocket part is formed to a certain depth. The absorbent layer consists of an outer skin layer, an intermediate layer containing an inorganic absorbent and a binder resin, and an inner skin layer that contains 5-80% by mass of metallocene polypropylene and 95-20% by mass of non-metallocene polypropylene. This innovative design addresses common challenges in blister packaging.
Career Highlights
Masayuki Hosoi is associated with Kyodo Printing Co., Ltd., where he has been instrumental in advancing packaging technologies. His work has not only contributed to the company's portfolio but has also set new standards in the industry.
Collaborations
Throughout his career, Masayuki has collaborated with talented individuals such as Kazumi Arai and Midori Kato. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge packaging solutions.
Conclusion
Masayuki Hosoi's contributions to blister packaging technology exemplify the importance of innovation in the field. His patent reflects a commitment to improving product functionality and reliability, making a significant impact on the packaging industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile