The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jun. 18, 2015
Applicant:

Kyodo Printing Co., Ltd., Tokyo, JP;

Inventors:

Masayuki Hosoi, Tokyo, JP;

Kazumi Arai, Tokyo, JP;

Midori Kato, Tokyo, JP;

Makoto Kato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61J 1/03 (2006.01); B65D 81/26 (2006.01); B32B 27/32 (2006.01); B32B 15/20 (2006.01); B32B 15/085 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
A61J 1/035 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/327 (2013.01); B65D 81/26 (2013.01); B32B 2307/538 (2013.01);
Abstract

The purpose of the present invention is to provide an absorbent layer for blister packs, which imparts sufficient formability and is free from forming failure even if a pocket part is formed to a certain depth. An absorbent layer for blister packs, which sequentially comprises, in the following order, an outer skin layer, an intermediate layer containing an inorganic absorbent and a binder resin, and an inner skin layer containing 5-80% by mass of a metallocene polypropylene and 95-20% by mass of a non-metallocene polypropylene.


Find Patent Forward Citations

Loading…