Company Filing History:
2 out of 8,782 
2 out of 39 Years Active: 2006
Title: Masato Take: Innovator in Semiconductor Technology
Introduction
Masato Take is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that address critical challenges in heat dissipation for semiconductor devices.
Latest Patents
His latest patents include a semiconductor device and a hybrid integrated circuit device. The semiconductor device addresses the issue of efficiently dissipating heat generated by resin-molded semiconductor elements. The invention features common leads coupled to an island, with a portion of the common leads projecting out from a resin seal body. This design allows for effective heat dissipation through the common leads, reducing thermal stress and potential damage to the semiconductor element.
The second patent, a resin sealing-type semiconductor device, comprises a first semiconductor chip that generates a large amount of heat and a second semiconductor chip that generates less heat. The first chip is molded using a high thermal conductive resin, while both chips are integrally molded using a non-high thermal conductive resin. This innovative approach enhances the overall thermal management of the device.
Career Highlights
Masato Take has worked with notable companies in the semiconductor industry, including Sanyo Electric Co., Ltd. and Kanto Sanyo Semiconductors Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
One of his notable collaborators is Isao Ochiai, with whom he has worked on various projects in the semiconductor field.
Conclusion
Masato Take's contributions to semiconductor technology through his innovative patents demonstrate his commitment to solving complex engineering challenges. His work continues to influence the industry and improve the performance of semiconductor devices.