The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Mar. 04, 2004
Isao Ochiai, Gunma, JP;
Masato Take, Saitama, JP;
Isao Ochiai, Gunma, JP;
Masato Take, Saitama, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunma, JP;
Abstract
A resin sealing-type semiconductor device comprises a first semiconductor chipwith a large amount of heat generation, whose external electrode leading-out bonding padsare wire-bonded to respective outer leadsA and a second semiconductor chipsmaller in the amount of heat generation than the first semiconductor chip, whose external electrode leading-out bonding padsare wire-bonded to respective outer leadsA, wherein the first semiconductor chipis molded by a high thermal conductive resin, and the second semiconductor chipand the first semiconductor chipmolded by the high thermal conductive resin are integrally molded by a non-high thermal conductive resin. A method includes manufacturing the resin sealing-type semiconductor device.