Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Masato Take

Isao Ochiai

The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.

Semiconductor device and hybrid integrated circuit device

A resin sealing-type semiconductor device comprises a first semiconductor chipwith a large amount of heat generation, whose external electrode leading-out bonding padsare wire-bonded to respective outer leadsA and a second semiconductor chipsmaller in the amount of heat generation than the first semiconductor chip, whose external electrode leading-out bonding padsare wire-bonded to respective outer leadsA, wherein the first semiconductor chipis molded by a high thermal conductive resin, and the second semiconductor chipand the first semiconductor chipmolded by the high thermal conductive resin are integrally molded by a non-high thermal conductive resin. A method includes manufacturing the resin sealing-type semiconductor device.

Growing community of inventors

Saitama, Japan

Masato Take