This inventor holds 1 USPTO granted patent. Top assignee: Shibuya Corporation. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Masato Kitagawa: Innovator in Bonding Technology
Introduction
Masato Kitagawa is a notable inventor based in Kanazawa, Japan. He has made significant contributions to the field of bonding technology, particularly in the development of innovative bonding apparatuses.
Latest Patents
Kitagawa holds a patent for a bonding head with large and small spray apertures. This bonding apparatus is equipped with a gas supplying unit that enables the spraying of an inert gas from a spray aperture located adjacent to the holding section of the bonding head. The design includes a wide slit that allows for a higher jet flow rate of the inert gas compared to the narrow slits. This configuration creates an air curtain that surrounds the bonding area between the semiconductor chip and the substrate, enhancing the bonding process.
Career Highlights
Masato Kitagawa is currently associated with Shibuya Corporation, where he continues to innovate and develop advanced bonding technologies. His work has been instrumental in improving the efficiency and effectiveness of semiconductor bonding processes.
Collaborations
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Conclusion
Masato Kitagawa's contributions to bonding technology exemplify the impact of innovative thinking in the semiconductor industry. His patent reflects a commitment to enhancing bonding processes, which is crucial for the advancement of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile