Masao Takata

Title: Masao Takata: Semiconductor Wafer and Device Innovations.

Introduction

Masao Takata is an inventor based in Tamba, Japan, associated with Mitsubishi Electric Corporation. His work includes semiconductor wafer processing and semiconductor device structures. The provided information lists 3 patents.

Latest Patents

**Semiconductor Wafer and Method for Manufacturing Semiconductor Wafer.** This invention concerns dicing a semiconductor wafer along lines in two different directions to separate chips from an effective area. The wafer includes a film formation pattern, and at least one dicing line overlaps that pattern along all or part of its length.

**Semiconductor Device.** This invention describes a device structure intended to reduce chipping in the device region while lowering manufacturing costs. It includes a substrate with a main surface and an end surface, plus an amorphous insulating film on the peripheral region. The film is separated from the device region, extends in a stripe along the substrate’s end surface, and is flush with that surface.

Career Highlights

Takata’s listed patent work addresses practical challenges in semiconductor manufacturing, including wafer dicing and protection against chipping. His association with Mitsubishi Electric Corporation connects these inventions to the company’s semiconductor technology activities.

Collaborations

Kouichi In and Masayoshi Tarutani are identified as Takata’s coworkers.

Conclusion

Masao Takata’s listed inventions focus on improving semiconductor wafer processing and device fabrication through approaches to dicing and chipping reduction.