The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Sep. 02, 2022
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Masao Takata, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/67092 (2013.01); H01L 22/34 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A semiconductor wafer is diced along a plurality of dicing lines in a first direction and a second direction different from the first direction so that a chip is cut out from an effective area. The semiconductor water includes a film formation pattern. At least one dicing line included in the plurality of dicing lines is an on-pattern dicing line which overlaps the film formation pattern in its entire or partial length.