Chiba, Japan

Masao Suzuki

This inventor holds 1 USPTO granted patent. Top assignee: Prime Polymer Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masao Suzuki. Retrieved from https://idiyas.com/inventor/masao-suzuki-etkxt61l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Masao Suzuki and His Ethylene Resin Film Patent.

Introduction

Masao Suzuki is an inventor associated with Chiba, Japan, and Prime Polymer Co., Ltd. His recorded patent work concerns an ethylene-based resin composition designed for film applications, including packaging materials.

Latest Patents

The available information lists one patent for Suzuki: “Ethylene Resin Composition and Film.” The invention describes an ethylene-based resin composition intended to help produce films that balance protective strength and rigidity, supporting features such as easy opening and the ability of packaging to stand on its own.

The composition is specified by four properties: a melt flow rate of 0.1–1.0 g/10 min at 190°C under a 2.16 kg load; a density of 915–935 kg/m³; a melt index (I21) of 45 or less at 190°C under a 21.6 kg load; and an Hh/Ht ratio of 10%–55%. The ratio compares the heat of fusion measured at 120°C or higher with the total heat of fusion determined from the DSC curve.

Career Highlights

Suzuki’s listed patent reflects work on material properties relevant to packaging films, where strength, rigidity, and practical usability need to be balanced. The supplied information identifies Prime Polymer Co., Ltd. as his company affiliation.

Collaborations

Keiko Sekiya and Yuta Kudo are listed as Suzuki’s coworkers. The available details do not specify their roles in the patent or the nature of their collaboration.

Conclusion

Masao Suzuki’s recorded invention focuses on an ethylene resin composition engineered for packaging films with a balance of protective strength, rigidity, and usability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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