The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Mar. 30, 2021
Prime Polymer Co., Ltd., Tokyo, JP;
PRIME POLYMER CO., LTD., Tokyo, JP;
Abstract
An ethylene-based resin composition having the following requirements (1) to (4) as a material such as packaging material, a film having strength for the protection and rigidity (e.g., easy opening and self-standability on packaging contents) in an excellent balance: (1) A melt flow rate (190° C., 2.16 kg load) is 0.1 g/10 min or more and 1.0 g/10 min or less, (2) a density is 915 kg/mor more and 935 kg/mor less, (3) a melt index (I21: 190° C., 21.6 kg load) is 45 or less, and (4) a ratio of the amount of heat of fusion at 120° C. or higher (Hh/Ht), which is the ratio of the amount of heat of fusion (Hh) determined from a DSC curve at 120° C. or higher to the total amount of heat of fusion (Ht) determined from a DSC curve of DSC measurement, is 10% or more and 55% or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile