Masao Arima

Title: Masao Arima: Innovator in Thermosetting Resin Technology

Introduction

Masao Arima is a notable inventor based in Sakado, Japan. He has made significant contributions to the field of thermosetting resin technology, holding a total of 3 patents. His work focuses on developing innovative materials that enhance the performance and reliability of electronic components.

Latest Patents

Arima's latest patents include a liquid thermosetting filling composition and a method for permanently filling holes in printed circuit boards. This composition consists of an epoxy resin, a phenolic resin, a curing catalyst, and an inorganic filler. It is particularly useful for filling via holes and through holes in multilayer and double-sided printed circuit boards. The method involves applying the composition to the board, precuring it with heat, and then polishing the surface before final curing. Another significant patent is a photocurable thermosetting resin composition that is developable with an aqueous alkali solution. This composition includes a photosensitive prepolymer, a diglycidyl ether type epoxy compound, a photopolymerization initiator, and a diluent, all combined in specific ratios to achieve optimal performance.

Career Highlights

Masao Arima is currently employed at Taiyo Ink Manufacturing Co., Ltd., where he continues to innovate in the field of resin technology. His work has been instrumental in advancing the capabilities of materials used in electronic manufacturing.

Collaborations

Throughout his career, Arima has collaborated with notable colleagues such as Shigeru Komori and Kazuo Suda. These partnerships have contributed to the development of cutting-edge technologies in the industry.

Conclusion

Masao Arima's contributions to thermosetting resin technology have made a significant impact on the electronics industry. His innovative patents and ongoing work at Taiyo Ink Manufacturing Co., Ltd. highlight his dedication to advancing material science.