The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1998
Filed:
Jun. 05, 1996
Masao Arima, Sakado, JP;
Abstract
A one-package type photosolder resist developable with an aqueous alkali solution and suitable for use as a solder resist for a printed circuit board is disclosed. The composition comprises (A) a copolymeric macromolecular compound containing at least one free carboxyl group in the molecular unit thereof or (A') a copolymeric macromolecular compound containing at least one free carboxyl group and at least one photoreactive unsaturated group in the molecular unit thereof and assuming a solid state at normal room temperature, (B) a diluent including a polyfunctional unsaturated compound assuming a liquid state at normal room temperature and/or an organic solvent, (C) a photopolymerization initiator, (D) a vinyltriazine compound or a derivative thereof, and (E) an inorganic filler. A process for forming a solder resist on a printed circuit board having a circuit preparatorily formed thereon comprises the steps of applying to the surface of said printed circuit board the one-package type photosolder resist composition mentioned above, drying the applied layer of said composition, selectively exposing the dried layer to actinic radiation according to a prescribed pattern, developing the unexposed area of said layer with an aqueous alkali solution thereby forming a solder resist pattern, and finally curing said resist pattern by exposure to actinic radiation.