Company Filing History:
Years Active: 2010
Title: Masanori Iriyama: Innovator in Printed Wiring Board Technology
Introduction
Masanori Iriyama is a notable inventor based in Ibi-gun, Japan. He has made significant contributions to the field of printed wiring board technology. His innovative approach has led to the development of a unique manufacturing method that enhances the reliability of printed wiring boards.
Latest Patents
Masanori Iriyama holds a patent for a manufacturing method and manufacturing apparatus of printed wiring boards. This patent involves a process where a solder ball is loaded on a bump of small height. The height of the bump is intensified by melting the solder ball using laser heating. This method allows for the adjustment of bump heights within a requested allowable range. Importantly, the bump is not removed by heating, which prevents local heat history from affecting the printed wiring board. This innovation significantly enhances the reliability of the bumps on printed wiring boards.
Career Highlights
Masanori Iriyama is associated with Ibiden Company Limited, where he has been instrumental in advancing technologies related to printed wiring boards. His work has been recognized for its impact on manufacturing processes and product reliability.
Collaborations
Masanori has collaborated with notable colleagues, including Yoichiro Kawamura and Katsuhiko Tanno. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Masanori Iriyama's contributions to printed wiring board technology exemplify innovation in manufacturing processes. His patented methods enhance product reliability and demonstrate the importance of advancements in this field.